Principal/Sr. Principal Engineer Microelectronic Semiconductors

RELOCATION ASSISTANCE: No relocation assistance available
CLEARANCE REQUIRED FOR START: No
CLEARANCE TYPE: Secret
TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies.

Northrop Grumman Mission Systems is seeking an experienced and motivated Microelectronics Semiconductor Metals Process Engineer (Principal or Sr. Principal) for our Advanced Packaging Technology facility in Apopka, Florida.

For more than 70 years, Northrop Grumman’s Microelectronics Center has pushed the boundaries in this ever-evolving field of microelectronics. Our two U.S.-based government-trusted foundries and state-of-the-art packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Microelectronic Semiconductor Metals Process Engineer will provide senior fabrication support and technical direction for a wide range of metals processes and tools for semiconductor wafers. The selected candidate will own the responsibility for process technology development and production deployment for multiple metal interconnect processes, including PVD and solder bumps fabricated across multiple equipment systems.

They will collaborate closely with other process owners for back-end post-processing to ensure satisfactory integration of under bump metallization and sphere drop processes into overall product flows for both production parts, as well as new process and product development activities.

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team.

Position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.

Responsibilities include, but are not limited to, the tasks outlined below:

Team:

• Primary metals team leader responsible for all PVD and plasma clean processes, development, and associated metrology. Role will require experience with production deployment across a broad range of tool sets, processes, and wafer sizes.
• Work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, high-volume ramp and drive continuous improvement initiatives.
• Mentor and train junior engineers and technicians on shift to support quality and delivery metrics for operations.
• Drive process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, and cost.

Process/ Equipment Management:

• Oversee and develop robust, manufacturable process recipes for Foundry customers in PVD, plasma cleans and bumping processes and the associated metrology and analysis using designs of experiments (DOEs) and industry standard methods.
• Identify, resolve issues, and improve these plating processes to provide maximum quality and process availability.
• Ensure all metals equipment is properly qualified and calibrated.

Process Development:

• Define and optimize PVD thin films, plasma cleans, dry etching(metal etch), sphere drop, and redistribution layers for bumping processes in support of new technologies.
• Develop new technologies across the portfolio of emerging technologies in semiconductor wafer-level interconnect manufacturing on multiple wafer sizes.

Quality Control:

• Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out of spec material.
• Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.
• Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.

Problem-Solving:

• Drive process improvements for volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.
• Lead Root Cause and Corrective Action (RCCA) task forces to troubleshoot and develop solutions that prevent recurrence for excursion incidents using 8D problem solving methodologies.

Safety Compliance:

• Adhere to all safety regulations and protocols to maintain a safe working environment.

Vendor Management:

• Collaborate and drive continuous improvement projects with both equipment vendors and materials suppliers.
• Support capital equipment projects through procurement, installation and release for production use

Production Support:

• Achieve customer on-time delivery and cycle time commitments through tool qualification and OEE management with manufacturing operations.
• Coordinates with production on day-to-day activities. Assists in the resolution of production workflow issues.
• Support manufacturing capacity planning optimization.

Documentation & Data Systems:

• Maintain accurate records of processes/recipes, quality checks, and maintenance activities.
• Support engineering data analysis including metrology data, ERP and MES data, and other in-process metrics

The selected candidate will possess a:

• Proven ability to lead and work efficiently in a group or as an individual contributor.
• Demonstrated ability to lead complex multi tool process development projects

This position may be filled at the Principal or Senior Principal level, depending on candidate experience.

Basic Qualifications for Principal Microelectronics Semiconductor Metals Process Engineer:

• Bachelor's Degree in Materials Science, or a related STEM field with a minimum of 5 years of semiconductor work experience; OR a master’s degree with 3 or more years of semiconductor work experience; OR a PhD with 1 of more years of semiconductor work experience.
• Experience in semiconductor PVD processes and equipment
• Experience in process set-up, optimization, and troubleshooting for PVD and plasma cleans.
• Experience with vacuum technology, thin-film stress, adhesion, uniformity, and contamination control
• Experience in a production manufacturing environment
• Experience in technical data collection, organization and analysis skills
• Experience in data analysis techniques/programs
• Excellent oral and written communication skills with a strong attention to detail.
• US Citizenship is required
• Ability to obtain Secret Clearance is required

Basic Qualifications for Senior Principal Microelectronics Semiconductor Metals Process Engineer:

• Bachelor's Degree in Materials Science, or a related STEM field with a minimum of (8) years of semiconductor work experience; OR a master’s degree with 6 or more years of semiconductor work experience; OR a PhD with 4 of more years of semiconductor work experience.
• Experience in semiconductor PVD processes and equipment
• Experience in process set-up, optimization, and troubleshooting for PVD and plasma cleans.
• Experience with vacuum technology, thin-film stress, adhesion, uniformity, and contamination control
• Experience in a production manufacturing environment
• Experience in technical data collection, organization and analysis skills
• Experience in data analysis techniques/programs
• Excellent oral and written communication skills with a strong attention to detail.
• US Citizenship is required
• Ability to obtain Secret Clearance is required

Preferred Qualifications for Both Levels:

• Experience with under bump metallurgy, and optimizing plasma parameters (RF power, gas chemistry, pressure, bias, time) to achieve residue-free surfaces
• Experience with JMP, MATLAB, VBA and/or similar
• Experience fabricating a wide variety of interconnect technologies and metals, including lead and lead-free solders and other metals systems.
• Experience in Design of Experiment (DOE), Statistical Process Control (SPC), and 6 sigma concepts for process development and control
• Experience in conducting FMEA analyses of processes and equipment
• Experience with MS Office software applications
• Experience with Enterprise Resource Planning and Manufacturing Execution Systems
• Experience with CAD software (AutoCAD, NX or similar)
• Experience with Minitab software
• Experience with SAP MRP software
• Experience across lithography, plasma descum, wet cleans, electroplating, etch, AOI and reflow
• Experience characterizing surface cleanliness using SEM, FTIR, ellipsometry, contact angle, and XPS
• Experience in flip-chip, 2.5D, and 3D packaging
• Experience in 8D Problem Solving
• Active Secret Clearance or Higher
• Six Sigma Blackbelt Certification

What We Can Offer You:

Northrop Grumman provides a comprehensive benefits package and a work environment that encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family.

Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off, and Additional Benefits, including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!

#MPR

Primary Level Salary Range: $98,400.00 - $123,000.00
Secondary Level Salary Range: $122,800.00 - $184,200.00
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.